发明名称 |
Integrated circuit package with keep-out zone overlapping undercut zone |
摘要 |
An integrated circuit package is provided with a connective structure having a wire bonding zone and a keep-out zone. An integrated circuit die has an undercut defining an undercut zone, which is overlapped by the keep-out zone. A wire is bonded between the integrated circuit die and the connective structure within the wire bonding zone and outside of the keep-out zone.
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申请公布号 |
US2005194698(A1) |
申请公布日期 |
2005.09.08 |
申请号 |
US20040794109 |
申请日期 |
2004.03.03 |
申请人 |
ST ASSEMBLY TEST SERVICE LTD. |
发明人 |
SHIM IL KWON;ARARAO VIRGIL C.;HUR HYEONG R.;HAN BYUNG J. |
分类号 |
H01L23/48;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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