发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND DISPLAY COMPONENT USING THE POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND DISPLAY COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in reflow resistance, and a semiconductor device and a display component using the same. <P>SOLUTION: The positive photosensitive resin composition comprises a polyamide resin (A) having unsaturated groups at molecular terminals and within a molecule and a diazoquinone compound (B), wherein the polyamide resin (A) having unsaturated groups at molecular terminals and within a molecule includes one or more polybenzoxazole precursor structures, one or more polyamide acid structures, or one or more polyamide ester structures. The semiconductor device and the display component using the composition are also provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005242343(A) |
申请公布日期 |
2005.09.08 |
申请号 |
JP20050019081 |
申请日期 |
2005.01.27 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
BANBA TOSHIO;TAKEDA NAOJI;HIRANO TAKASHI |
分类号 |
G03F7/027;G03F7/037;G03F7/075;G03F7/40;H01L21/027 |
主分类号 |
G03F7/027 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|