| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease a burden of the environment in a packaging of a semiconductor device with a small tab structure. <P>SOLUTION: The semiconductor device with a surface mounting type and the small tab structure, and the semiconductor device with a surface mounting type and a large tab structure, are prepared. The semiconductor device with the small tab structure is packaged by a non-moistureproof package and is shipped, and the semiconductor device with the large tab structure is packaged by a moistureproof package and is shipped. When these packages are compared with moistureproof packaging for both semiconductor devices with the small tab structure and the large tab structure and shipping them, in shipping the semiconductor device with the small tab structure, it is unnecessary to use a drier such as an aluminum moistureproof bag 16 and a silica gel 10 and in addition, to use a hardly recyclable member such as a humidity indicator 11, so that the burden of the environment can be decreased. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
