MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND DOUBLE-SIDED ADHESIVE SHEET FOR CUTTING ELECTRONIC ARTICLE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component with which chipping is suppressed even if the thinned electronic component to be cut is cut and divided by using a rotary knife. SOLUTION: Support substrates and the electronic component to be cut are cut and divided in a state where the support substrates (3) are laminated on a surface and a rear face of the electronic component to be cut (1) through double-sided adhesive layers (2) having at least one adhesive layer. COPYRIGHT: (C)2005,JPO&NCIPI