发明名称 COOLING MODULE
摘要 PROBLEM TO BE SOLVED: To provide a cooling module which can raise cooling effect without affecting the size of a body and realize silent design while restraining a manufacturing cost. SOLUTION: A lamination fin 17 is formed by combining a plurality of fins 16 of different lengths. Since the shape of the lamination fin 17 is changed step by step in accordance with the shape of a fan 9, the distance from the outer circumference of a fan blade 7 constituting the fan 9 to one end 17a of the lamination fin 17 can be held even if each fin 16 constituting the lamination fin 17 is lengthened for raising cooling effect. Therefore, cooling effect can be improved without affecting the size of the body and at the same time silent design can be realized. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005243925(A) 申请公布日期 2005.09.08
申请号 JP20040051814 申请日期 2004.02.26
申请人 TOSHIBA HOME TECHNOLOGY CORP 发明人 YAMADA KENTARO;KOBAYASHI TAKASHI;KAWASHIMA TOMIO
分类号 H05K7/20;H01L23/467;(IPC1-7):H05K7/20 主分类号 H05K7/20
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