| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic circuit board with considerations of both securing an etching margin and preventing a short circuit due to a conductor separation defect when an area of a plating resist layer is reduced accompanied by the securement of the etching margin. SOLUTION: A plating window is created while being corrected in the direction of area expansion by an amount of correction which reflects the etching margin in an etching process. In performing the correction, when a distance between two conductor elements adjacent to each other in the same conductor layer is a reference value or above, a predetermined standard amount of correction is used. However, when the distance between the two adjacent conductor elements is less than the reference value, an amount of correction for protecting the plating resist layer which is smaller than the standard amount of correction is used to suppress excessive narrowing in the width of the plating resist layer located between the plating windows corresponding to such conductor elements. COPYRIGHT: (C)2005,JPO&NCIPI |
