| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer laminated substrate capable of surely connecting layers electrically and also laminating the layers easily. SOLUTION: A multilayer laminated wiring board is composed of at least two double-sided wiring boards including wiring patterns made of conductive metals formed on both surfaces of an insulation substrate 10, with the respective wiring patterns formed on the insulation substrate connected via the conductive metal in through holes passing through the insulation substrate, while the multilayer laminated wiring board has electrical connection between the respective double-sided wiring boards. Low melting point conductive metal layers 33 formed on the surface of a connection terminal formed on a laminate surface in the respective double-sided wiring boards are joined, whereby the respective double-sided wiring boards are electrically connected. In addition, at least two double-sided wiring boards are glued with a polyimide-based adhesive resin 35 selectively applied by screen-printing on regions of the respective double-sided wiring boards except the connection terminal regions. COPYRIGHT: (C)2005,JPO&NCIPI |
