| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate and a high-frequency circuit device obtaining excellent high-frequency characteristics. SOLUTION: The multilayer substrate 1 has a dielectric layer 10a, a surface conductor layer L1, which is formed on the surface of the dielectric layer 10a and to which a high-frequency circuit 13 is formed, and an internal conductor layer 10c (L2) formed on the rear of the dielectric layer 10a. The multilayer substrate further has other layers l2 and 11 (llb, 11a and 11c) joined with the internal conductor layer 10c (L2) so that a part of the internal conductor layer 10c (L2) is exposed. The high-frequency circuit device has the multilayer substrate 1, a box body 3 joined with a section, from which the internal conductor layer 10c (L2) of the multilayer substrate 1 is exposed, and a high-frequency device 2 loaded on the box body 3 and connected to the high-frequency circuit 13 formed to the surface conductor layer L1 of the multilayer substrate 1. COPYRIGHT: (C)2005,JPO&NCIPI |
