| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board suited for improving quality, such as electrical characteristics, in a wiring board that does not have core substrate and allows a conductive layer and a dielectric layer to be laminated, and to provide a method for manufacturing the wiring board. SOLUTION: In the wiring board, both the conductive layer and the dielectric layer are laminated so that the main surfaces are composed of the dielectric layer without core substrates, and a metal terminal pad is formed in the opening of the dielectric layer for forming at least one main surface. In the wiring board, a metal terminal pad PD1 is composed of a pad body, that has an exposure surface in the opening and is subjected to via connection to the conductive layer M1 inside the wiring board 1 on the back of the exposure surface, and a wall surface conductive section, formed along the wall of the opening in the inner-layer direction of the wiring board 1 from the outer edge of the pad body. COPYRIGHT: (C)2005,JPO&NCIPI |
