| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for packaging an electronic component capable of packaging a highly reliable bonding without decreasing a productivity and a packaging quality even for a micro and narrow pitch of the electronic component. <P>SOLUTION: The method for packaging the elctronic component comprises the steps of printing cream solders 4, 5 on a circuit board 1 with the use of a mask having the predetermined opening part, suppressing a mobility of the cream solder so as to keep the printed shape of the printing cream solders 4, 5, applying a reinforcing thermosetting resin 10 on the circuit board 1 including cream solders 14, 15 with their mobility suppressed, mounting the electronic components 6, 7 to the predetermined position of the circuit board 1, soldering electrode lands 2, 3 and the electrodes 6a, 7a of the electronic components 6, 7 on the circuit board 1 and hardening the reinforcing resin 10 by heating. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
