发明名称 Laser processing method and laser processing apparatus
摘要 A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.
申请公布号 US2005194364(A1) 申请公布日期 2005.09.08
申请号 US20050106657 申请日期 2005.04.15
申请人 HAMAMATSU PHOTONICS K.K. 发明人 FUKUYO FUMITSUGU;FUKUMITSU KENSHI;UCHIYAMA NAOKI;WAKUDA TOSHIMITSU;ATSUMI KAZUHIRO;MURAMATSU KENICHI
分类号 B23K26/04;B23K26/06;B23K26/073;B23K26/38;B23K26/40;B28D5/00;C03B33/023;C03B33/08;C03B33/10;C03C23/00;G02F1/1368;(IPC1-7):B23K26/14 主分类号 B23K26/04
代理机构 代理人
主权项
地址