发明名称 METHOD AND DEVICE FOR SOLIDIFYING GRINDING OR POLISHING SWARF
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for solidifying coolant containing grinding or polishing swarf of severalμm to 150μm whose control is easy, in which no energy losses are present, and in which binder is unnecessary. SOLUTION: In the solidifying method, grinding swarf 30 or the like containing coolant charged in a cylinder 1 is pressed by a piston 21 to discharge the contained coolant, and grinding swarf or the like is solidified. A main hydraulic cylinder 51 and a sub hydraulic cylinder 52 are mounted on the piston, and the swarf is solidified by a first step of reducing the volume of the coolant content of grinding waste or the like in the cylinder by the pressing force of only the sub hydraulic cylinder, and a second step of solidifying grinding swarf by the pressing force of the main hydraulic cylinder. When the average grain size of the grinding swarf or the like is≥1μm to≤5μm, the feed rate in the first step is set to be≥1 mm/sec and≤5 mm/sec. The coolant content of the grinding waste after the first step and before the second step is set to be≥10% and≤30%. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005238288(A) 申请公布日期 2005.09.08
申请号 JP20040051561 申请日期 2004.02.26
申请人 NACHI FUJIKOSHI CORP;NIFUKO PLANT KK;MORI TEKKO KK 发明人 MIWA SHIGEKI;IWANAMI TADASHI;MORI KOICHI
分类号 B24B55/12;B30B9/28;C02F11/00;C02F11/12;(IPC1-7):B30B9/28 主分类号 B24B55/12
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