摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting resin composition for a printed wiring board which exhibits temporally stable coating properties in screen printing, curtain coating, spray coating, roll coating and in other methods and is superior in heat resistance, adhesion and electrical insulation, and to provide a printed wiring board which uses the same. <P>SOLUTION: The photosetting/thermosetting resin composition comprises (A) a carboxylic resin, having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a polyhydroxycarboxylic ester additive, (D) a diluent, (E) a filler and (F) an epoxy resin, wherein the polyhydroxycarboxylic ester additive (C) is preferably xylene-free. <P>COPYRIGHT: (C)2005,JPO&NCIPI |