发明名称 PHOTOSETTING/THERMOSETTING RESIN COMPOSITION AND PRINTED WIRING BOARD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosetting/thermosetting resin composition for a printed wiring board which exhibits temporally stable coating properties in screen printing, curtain coating, spray coating, roll coating and in other methods and is superior in heat resistance, adhesion and electrical insulation, and to provide a printed wiring board which uses the same. <P>SOLUTION: The photosetting/thermosetting resin composition comprises (A) a carboxylic resin, having one or more carboxyl groups in one molecule, (B) a photopolymerization initiator, (C) a polyhydroxycarboxylic ester additive, (D) a diluent, (E) a filler and (F) an epoxy resin, wherein the polyhydroxycarboxylic ester additive (C) is preferably xylene-free. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005241977(A) 申请公布日期 2005.09.08
申请号 JP20040051686 申请日期 2004.02.26
申请人 TAIYO INK MFG LTD 发明人 UEDA CHIHO;KURIHARA KOJI
分类号 G03F7/004;C08G59/62;C08K3/36;C08K5/00;C08L63/00;C09D163/00;C09D201/08;G03F7/027;H05K1/00;H05K3/28;H05K3/46 主分类号 G03F7/004
代理机构 代理人
主权项
地址