| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for easily obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated without having a core substrate. SOLUTION: On the main surface of a foundation dielectric sheet formed on a support substrate for reinforcement in manufacture, a laminated sheet body, having a first dielectric sheet arranged via an adhesive layer so that it is included on the main surface, and a second dielectric sheet is formed so that it covers the first dielectric sheet and seals the first dielectric sheet, by adhering to the ground dielectric sheet at the peripheral region of the first dielectric sheet. The first dielectric sheet and a region on it are set to be a wiring laminate that should serve as a wiring board in the lamination sheet body, the peripheral section is removed, the end face of the wiring laminate is exposed, and the wiring laminate is released between the first dielectric sheet and the adhesive layer from the support substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
