发明名称 STRUCTURE FOR INCORPORATING ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a structure for incorporating an electronic component in which the electronic component can be securely attached to and easily removed from a frame. SOLUTION: The structure comprises: an electronic component holder 180 equipped with a first tenon 114, a second tenon 116, and an electronic component mount provided on the top surface 122 of the first tenon 114; a first frame 170b formed with a rabbet joint tenon groove 130 into which the first tenon 114 can be fitted; and a second frame 170a formed with a halving joint tenon groove 310 into which the second tenon 116 can be fitted. The first frame 170b and the second frame 170a are positioned on almost opposite sides of an attachment/removal space 110 where the electronic component holder 180 can be attached to or removed from a frame 160. The attachment/removal space 110 has an internal shape which allows the first tenon 114 to be guided into the rabbet joint tenon groove 130 after the second tenon 116 is guided into the halving joint tenon groove 310. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005244216(A) 申请公布日期 2005.09.08
申请号 JP20050038662 申请日期 2005.02.16
申请人 AU OPTRONICS CORP 发明人 CHANG YU-HSIU;CHAO HAO-LIANG
分类号 H05K7/14;G02F1/13;G02F1/133;G02F1/136;G04G17/04;H01L21/00;H01R12/00;H01R13/42;(IPC1-7):H05K7/14 主分类号 H05K7/14
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