| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding structure of a high-density pin capable of performing a high-density arrangement of a pin easily. SOLUTION: In the structure, well-known lead frame intersection pins are improved, block shaped-pins of a plurality of arrangement are provided to the lead frame, at least one conductive contact surface is formed at the pin bottom end, at least one insulator is arranged at the conductive contact surface of each pin, and the insulator of each pin is formed in intersection arrangement having a space. This makes an exposed conductive contact surface of each insulator which is adjacent each other be arranged in intersection arrangement having the space. COPYRIGHT: (C)2005,JPO&NCIPI
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