| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for which peeling is not generated in a conductor circuit. SOLUTION: In the printed wiring board, the conductor circuit is composed of two or more kinds of metal layer parts, and at least the width of a second metal part on an inner layer side is larger than the width of a first metal part on an outer layer side. In a method of manufacturing the printed wiring board by a transfer method, after forming the two or more kinds of metal layer parts by a plating processing on a metal carrier, the metal parts are etched such that at least the width of the first metal part on the outer layer side of the metal layer parts becomes smaller than the width of the second metal part on the inner layer side, the conductor circuit is formed. COPYRIGHT: (C)2005,JPO&NCIPI
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