发明名称 VACUUM TREATMENT SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a vacuum treatment system where the object to be treated can be continuously subjected to vacuum treatment such as sputtering and CVD (chemical vapor deposition). SOLUTION: In the vacuum treatment system where the object to be treated is fed from an air atmosphere to load lock chambers, and is subjected to vacuum treatment in a vacuum chamber, the plurality of load lock chambers are formed in the upper side direction and the lower side direction of the vacuum chamber, further, each load lock chamber in the upper side direction of the vacuum chamber has an exhaust/decompression means for exhausting/decompressing from the air atmosphere, each load lock chamber in the lower side direction has an intake/pressurization means for gradually returning from the vacuum state to the atmospheric pressure, also, the upper part and the lower part of each load lock chamber have opening parts, and each opening part is provided with an opening/closing door for moving the object to be treated from the opening part through the load lock chamber by gravity. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005240058(A) 申请公布日期 2005.09.08
申请号 JP20040047430 申请日期 2004.02.24
申请人 TOPPAN PRINTING CO LTD 发明人 KIKUCHI JUN;TAKEDA AKIRA;KUSAKA NAOTO
分类号 C23C14/56;C23C16/44;(IPC1-7):C23C14/56 主分类号 C23C14/56
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