PACKAGE FOR ACCOMMODATING ELECTRONIC COMPONENT, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide an airtight package for accommodating electronic components by joining a lid body to a package surface for accommodating electronic components with high strength.

SOLUTION: The package comprises an insulating substrate 1 in which a mounting section 1a of electronic components 4 is formed on the upper surface; a wiring conductor 5 formed on the upper surface of the insulating substrate 1; and a frame-like metallized layer 3 formed at the outer periphery of the upper surface of the insulating substrate 1 so that the mounting section is surrounded. In the metallized layer 3, a group of projections comprising a plurality of projections 3a arranged in a frame shape as a whole with a fixed interval in parallel to the inner outer periphery of the metallized layer 3 are formed on the surface concentrically with the metallized layer 3, and the group of projections have a larger interval toward the outer-periphery side.

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