| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit module which reinforces security, while suppressing rise in the manufacturing cost or the like. SOLUTION: The integrated circuit module includes a substrate 10a, on which a plurality of integrated circuit chips 20, 30, 40 are arranged; an interconnect 13 which is the interconnect provided at the substrate 10a and is used as a transmission line of data to be exchanged between the integrated circuit chips 20, 30, 40; a mold which covers at least the integrated circuit chips 20, 30, 40; and a conductive layer 101, which is provided at the substrate 10a, and is arranged so that it may cover at least the interconnect 13 so that it does not short-circuit with the interconnect 13. COPYRIGHT: (C)2005,JPO&NCIPI
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