| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To divide a substrate with high safety and reliability by generating a long internal crack in the substrate. <P>SOLUTION: The internal crack 12 is generated in the silicon substrate 10 by condensing laser light L as chirp light pulses which vary in wavelength with time. The focusing point of the chirp light pulses moves from A<SB>1</SB>to A<SB>3</SB>along the depth, so the internal crack 12 becomes long in crack length (b) by its movement quantity (Δa), and the reliability of division is improved. On a substrate top surface 11, a surface processing trace 11a as a linear processed part by scribing is provided. In a dividing process of dividing the silicon substrate 10 into element chips with an external force, stress concentrates on the surface processing trace 11a which connects with the internal crack 12, and then the substrate top surface 11 is securely divided along a division schedule line, so that precise division is carried out. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
