发明名称 LASER CUTTING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser cutting method that facilitates obtaining of laser energy for laser cutting and that dispenses with special surface treatment of a material to be cut in a pre-cutting stage. <P>SOLUTION: Before laser cutting of a material B to be cut, a film 17a capable of absorbing laser energy is formed on the surface of the material B in the area including an intended cutting line 23 and its proximity. Thereafter, laser cutting is performed along the cutting line 23 where the film 17a is formed. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005238259(A) 申请公布日期 2005.09.08
申请号 JP20040049116 申请日期 2004.02.25
申请人 KOIKE SANSO KOGYO CO LTD 发明人 KOIKE TETSUO;KOJO AKIRA;MASUDA SATOSHI
分类号 B23K26/00;B23K26/18;B23K26/38;B23K103/04;(IPC1-7):B23K26/00 主分类号 B23K26/00
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