发明名称 FLEX RIGID WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a flex rigid wiring board which has sufficient layer insulation pressure resistance between wiring patterns provided for a plurality of layers and has superior flexibility in a flexible portion. SOLUTION: At least one rigid substrate portion R comprises at least two conductive layers 6, 11, and an insulating layer which is held in between the conductive layers 6, 11 and insulates the conductive layers. The insulating layer includes a first insulating layer 7 and a second insulating layer 8 divided in the direction of thickness, and a flexible portion F is formed by including the same layer as any one of the first insulating layer 7 and the second insulating layer 8. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005244024(A) 申请公布日期 2005.09.08
申请号 JP20040053493 申请日期 2004.02.27
申请人 VICTOR CO OF JAPAN LTD 发明人 SHINDO MOTOSHI;MICHIWAKI SHIGERU;NAKAMURA HIROSHI;HARA KAZUHIKO;OTSUKI MITSURU
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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