摘要 |
PROBLEM TO BE SOLVED: To provide a flex rigid wiring board which has sufficient layer insulation pressure resistance between wiring patterns provided for a plurality of layers and has superior flexibility in a flexible portion. SOLUTION: At least one rigid substrate portion R comprises at least two conductive layers 6, 11, and an insulating layer which is held in between the conductive layers 6, 11 and insulates the conductive layers. The insulating layer includes a first insulating layer 7 and a second insulating layer 8 divided in the direction of thickness, and a flexible portion F is formed by including the same layer as any one of the first insulating layer 7 and the second insulating layer 8. COPYRIGHT: (C)2005,JPO&NCIPI |