| 摘要 |
<P>PROBLEM TO BE SOLVED: To image an accurately formed positioning mark with reflected light and relatively position a wiring board work and an exposure mask based on an imaging result. <P>SOLUTION: A method of manufacturing the wiring board comprises a step of stacking a conductor layer M1 and a dielectric layer V1 in this order on a plate-like core 2 and a step of irradiating the main surface of the dielectric layer V1 with laser light to form a positioning mark 50. Light for detecting a position is emitted from the main surface of the dielectric layer V1 to the positioning mark 50 and reflected light is detected. A wiring board work 1' and the exposure mask are relatively positioned based on a detection result. In a step of forming the positioning mark 50, laser light is emitted to a region 58 to be excavated while an irradiation position is displaced so as to overlap in the circumferential direction and radial direction of the ring-like region 58 to be excavated. Thus, the positioning mark 50 is formed in which a groove 50a is formed by excavating the dielectric layer V1 like a ring and the conductor layer M1 is exposed in the groove 50a. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
