发明名称 PLASMA TREATMENT METHOD AND APPARATUS THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To form plasma by stable glow discharge or Townsent discharge with high density over a wide range under pressure close to atmospheric pressure to perform highly productive plasma treatment even if an object to be treated is a metallic member with a large area. <P>SOLUTION: A plasma treatment device 1 includes a first electrode 5 composed of metallic substrates 3 each having a plurality of through holes 2 overlaid to cause the holes 2 to coincide with one another, a second electrode 6 composed of substrates of the same structures provided in parallel, a first gas supply means 7 for supplying an inert gas with the pressure close to the atmospheric pressure in the direction of blowing toward the second electrode 6, a second gas supply means 8 for supplying a surface treatment gas or a reactive gas below the second electrode 6, a first power source 9 for applying a voltage between the metallic substrates 3 to generate source plasma in the through holes 2, and a second power source 10 for applying a voltage between the first and second electrodes 5 and 6 to generate wide range plasma in a gap AP. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005243905(A) 申请公布日期 2005.09.08
申请号 JP20040051446 申请日期 2004.02.26
申请人 KANSAI TLO KK 发明人 TACHIBANA KUNIHIDE;INOUE RYOJI;TACHIKAWA KIYOSHI;WAKAZONO TAKAHIRO
分类号 H05H1/24;B08B7/00;H01L21/205;H01L21/304;H01L21/3065 主分类号 H05H1/24
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