| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a composition for resistors adhering to copper surface without requiring an initial passivation of the copper surface, exhibiting stability to all of an accelerated aging testing in environment of 85°C and 85% relative humidity, thermal cycling performance testing and solder exposure resistance testing, and to provide a conductive phase designed to have a temperature coefficient of resistance. <P>SOLUTION: This invention relates to the composition comprising: a polymer with a glass transition temperature of≥250°C, and a water absorption of 2% or less, one or more metals or metal compounds, and an organic solvent, wherein the polymer is selected from the group consisting of a polynorbornene, a polyarylate and a mixture of the same. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
