发明名称 |
EVAPORATOR, HEAT PUMP, AND HEAT UTILIZATION DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide an evaporator capable of suppressing height of a device, and a heat pump and a heat utilization device using it in regard to an evaporator circulating, and distributing or spraying a refrigerant. SOLUTION: In the evaporator 100 cooling ambient matter by evaporating the refrigerant W, a refrigerant circulating part 104 is provided for pumping up the refrigerant W in the evaporator 100 by an ejector pump 105 and distributing it in the evaporator 100. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005241204(A) |
申请公布日期 |
2005.09.08 |
申请号 |
JP20040053907 |
申请日期 |
2004.02.27 |
申请人 |
TOKYO ELECTRIC POWER CO INC:THE |
发明人 |
WATANABE KENJI;MATSUSHITA YOSHIAKI;ITO TOMOYA;SAKATA HIROYUKI |
分类号 |
F25B1/00;F25B1/08;F25B39/02;F28D5/02;(IPC1-7):F25B39/02 |
主分类号 |
F25B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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