发明名称 EVAPORATOR, HEAT PUMP, AND HEAT UTILIZATION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporator capable of suppressing height of a device, and a heat pump and a heat utilization device using it in regard to an evaporator circulating, and distributing or spraying a refrigerant. SOLUTION: In the evaporator 100 cooling ambient matter by evaporating the refrigerant W, a refrigerant circulating part 104 is provided for pumping up the refrigerant W in the evaporator 100 by an ejector pump 105 and distributing it in the evaporator 100. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005241204(A) 申请公布日期 2005.09.08
申请号 JP20040053907 申请日期 2004.02.27
申请人 TOKYO ELECTRIC POWER CO INC:THE 发明人 WATANABE KENJI;MATSUSHITA YOSHIAKI;ITO TOMOYA;SAKATA HIROYUKI
分类号 F25B1/00;F25B1/08;F25B39/02;F28D5/02;(IPC1-7):F25B39/02 主分类号 F25B1/00
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