| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems, wherein there is a limitation in increasing the positional accuracies of containers or lids according to their miniaturization, and that locating and assembling of the containers or the lids one by one may increase the number of steps and deteriorate a productivity. SOLUTION: A method for manufacturing an electronic component package comprises the steps of arranging a container sheet, having a plurality of containers whose one shorter-side side wall tops formed with inspecting electrode pads are adjacent to the other shorter-side widewall tops; arranging a metallic plate on a metal-plated layer in each column direction, the metal plate having a length dimension in the column direction of the container sheet and such a width dimension as to cover recessed openings of containers in one column; irradiating a laser beam on the metallic plate, corresponding to the position of the metal-plated layer from the upper side of the metal plate to weld and join the metal-plated layer to the metal plate; and cutting the container sheet including the metal plate into individual containers having an outer size. COPYRIGHT: (C)2005,JPO&NCIPI
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