发明名称 PACKAGE FOR ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To easily change positions of external terminals connected to a circuit on a board side. SOLUTION: A package 32 for accommodating a piezoelectric resonator element 14 includes more mounting electrodes 44 (44a-44d) than connecting electrodes 20 (20a, 20b) of the piezoelectric resonator element 14. The mounting electrode 44a and the mounting electrode 44d are electrically connected with a wiring pattern 46. In the lower surface of a package body 34, external terminals 48 (48a-48d) are formed at four corners thereof. The external terminals 48 are bonded to a mounting board. The external terminals 48a-48d are electrically connected to the corresponding mounting electrodes 44a-44c. The external terminals 48 are not electrically connected to any mounting electrode. Therefore, a pair of connecting electrodes 20 of the piezoelectric resonator element 14 are bonded to the mounting electrodes 44a, 44b or bonded to the mounting electrodes 44c, 44d, thereby changing the positions of external terminals for operating a piezoelectric resonator 30. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005244939(A) 申请公布日期 2005.09.08
申请号 JP20040370811 申请日期 2004.12.22
申请人 SEIKO EPSON CORP 发明人 MIYAZAKI KATSUHIKO
分类号 H01L23/04;H01L41/04;H01L41/08;H01L41/18;H02N2/00;H03B5/32;H03H3/02;H03H9/02;H03H9/05;H03H9/10;H03H9/15;(IPC1-7):H03H9/02 主分类号 H01L23/04
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