发明名称 |
MODULE WITH BUILT-IN COMPONENTS AND ELECTRONIC DEVICES PROVIDED WITH SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a module with a built-in component which can be produced without necessitating a via-forming process. SOLUTION: The module with a built-in component 100 has an insulating sheet substrate 10 which has an upper surface 10a, a lower surface 10b opposite to the upper surface and a side surface 10c which joins these surfaces; at least one wiring 20 which extends from the upper surface to the lower surface through the side surface; and electronic components 32 disposed within the sheet substrate. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005244211(A) |
申请公布日期 |
2005.09.08 |
申请号 |
JP20050021759 |
申请日期 |
2005.01.28 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ASAHI TOSHIYUKI;KARASHIMA YASUHARU;ICHIYANAGI TAKASHI;NAKATANI SEIICHI;NISHIYAMA TOSAKU |
分类号 |
H05K1/11;H01L25/04;H01L25/18;H05K1/18;H05K3/00;H05K3/40;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|