发明名称 |
RESIN COMPOSITION, PREPREG AND METAL CLAD LAMINATED BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in drilling processability represented by a long drill life, a small hole wall roughness and a good hole position accuracy, a prepreg using the same and a metal clad laminated board. SOLUTION: The resin composition contains (a) a thermosetting resin and (b) 40-70 wt.% inorganic filler. Here, (b) the inorganic filler comprises 50-80 wt.% synthetic spherical silica having an average particle size of 0.4-0.7μm and 20-50 wt.% inorganic filler having a Mohs' hardness of 1-5. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005239760(A) |
申请公布日期 |
2005.09.08 |
申请号 |
JP20040047723 |
申请日期 |
2004.02.24 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
OSE MASAHISA;SHIMAOKA SHINJI;SUGANO TOMOYOSHI;SUGAWARA IKUO;FUKUDA TOMIO;KOBAYASHI KAZUHITO;MIYATAKE MASATO;KATO AKIRA |
分类号 |
C08J5/24;B32B15/08;C08K3/22;C08K7/18;C08L101/00;H05K1/03;(IPC1-7):C08L101/00 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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