发明名称 |
Optical semiconductor device |
摘要 |
A laser device includes a can package of a laser diode having a lead terminal secured to a through hole in a stem by a sealant, and a flexible substrate having a transmission line on a front surface of a polyimide film. The lead terminal of the can package and one end of a transmission line of the flexible substrate are connected by soldering. A resistor for matching the impedance of the transmission line and the impedance of the lead terminal is located in the vicinity of a connection of the transmission line and the lead terminal.
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申请公布号 |
US2005194663(A1) |
申请公布日期 |
2005.09.08 |
申请号 |
US20050052932 |
申请日期 |
2005.02.09 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
ISHIMURA EITARO |
分类号 |
H01L23/12;H01L23/495;H01L25/00;H01S5/022;H01S5/042;H05K1/02;H05K1/14;H05K1/18;H05K3/34;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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