| 发明名称 |
Protective tape for use in grinding back of semiconductor wafer and method of fabricating semiconductor device |
| 摘要 |
A protective tape protecting a surface of a semiconductor wafer in a process of grinding a back of the wafer includes a layer of polyethylene terephthalate, an intermediate layer formed on the polyethylene terephthalate layer so as to have an elasticity modulus ranging from 20 MPa to 40 MPa, and an adhesive layer formed on the intermediate layer.
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| 申请公布号 |
US2005196942(A1) |
申请公布日期 |
2005.09.08 |
| 申请号 |
US20050065060 |
申请日期 |
2005.02.25 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OKADA DAICHI;KAWATO MASATOSHI;OONISHI SHIGETAKA |
| 分类号 |
C09J7/02;C09J201/00;H01L21/301;H01L21/304;H01L21/78;(IPC1-7):H01L21/78 |
主分类号 |
C09J7/02 |
| 代理机构 |
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