Wiring method for forming a re-wiring lead on a surface of an integrated circuit has a bare fuse element and a wiring area that can be cut through

摘要

An integrated circuit (1) has a bare fuse element (3) with a wiring area that can be cut through. A protective layer is applied over the wiring area of the fuse element. The surface of the integrated circuit is processed so as to form a re-wiring lead (7). The protective layer is removed so as to bare the wiring area of the fuse element. An independent claim is also included for an integrated circuit designed as a water level package with a re-wiring lead on a surface.