发明名称 LIGHT EMITTING ELEMENT, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To effectively use a GaAs substrate for light emitting layer portion growth which has been removed wholly as a functional element constituting element, and also to improve extraction efficiency of light emission to exterior. <P>SOLUTION: A compound semiconductor layer 10k for separation comprising III-V group compound semiconductor single crystal whose composition is different from GaAs is grown on the first main surface of a substrate body 10m comprising GaAs single crystal, a sub-substrate 10e comprising GaAs single crystal is grown on the compound semiconductor layer 10k for separation, and a substrate 10 for compound growth is formed. A main compound semiconductor layer 40 having a light emitting layer 24 is grown on the first main surface of the substrate 10. Furthermore, by eliminating the compound semiconductor layer 10k with chemical etching, the sub-substrate 10e is separated from the substrate 10 for compound growth and made a remaining substrate 1 onto the second main surface of the main compound semiconductor layer 40, and a notch 1j is formed on the remaining substrate. The bottom surface of the notch 1j is made an optical extraction surface or a reflecting surface to luminescence flux of light from the light emitting layer 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005243954(A) 申请公布日期 2005.09.08
申请号 JP20040052360 申请日期 2004.02.26
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 YAMADA MASAHITO;TAKAHASHI MASANORI
分类号 H01L33/10;H01L33/30;H01L33/40;H01L33/62;H01S5/323 主分类号 H01L33/10
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