发明名称 Methods and apparatus for printing conductive thickfilms over thickfilm dielectrics
摘要 In one embodiment, a plurality of thickfilm dielectric layers are printed on a substrate, with each successive layer being printed over a previous layer, and with each layer having sloped walls. After printing a first subset of the plurality of thickfilm dielectric layers, a first conductive thickfilm is printed over at least the walls of the first subset of dielectric layers. Then, after printing a second subset of the plurality of thickfilm dielectric layers, a second conductive thickfilm is printed over the second subset of dielectric layers (with the first and second conductive thickfilms being electrically coupled).
申请公布号 US2005195052(A1) 申请公布日期 2005.09.08
申请号 US20040793022 申请日期 2004.03.03
申请人 DOVE LEWIS R.;CASEY JOHN F. 发明人 DOVE LEWIS R.;CASEY JOHN F.
分类号 H01L21/48;H01L21/768;H01L49/00;H01P3/08;H05K1/02;H05K1/09;H05K3/00;H05K3/46;(IPC1-7):H01P3/08 主分类号 H01L21/48
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