发明名称 |
Multi-layer polishing pad material for CMP |
摘要 |
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
|
申请公布号 |
US2005197050(A1) |
申请公布日期 |
2005.09.08 |
申请号 |
US20050113498 |
申请日期 |
2005.04.25 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
PRASAD ABANESHWAR;LACY MICHAEL S. |
分类号 |
B24B7/30;B24B37/20;B24B37/22;B24D3/32;B24D13/14;(IPC1-7):B24B7/30 |
主分类号 |
B24B7/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|