| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide double-face polishing device and method therefor, with which work efficiency can be improved, even if hybrid treatment is performed in polishing of the double faces of a semiconductor wafer which suppress enlargement of the device and rise in cost. <P>SOLUTION: In the double face polishing device, a buffer container 12 which temporarily stores the polished wafer has been previously installed in an unloader 16 separate from a collection container 17. When the wafer W stored in a box 11 and the other wafer which is not stored in the box are set in the same carrier 4 and they are polished, the wafer stored in the box among the polished wafers is collected in the collection container and the other wafer is once stored in the buffer container. The collection container is exchanged with the new collection container, and then the wafer stored in the buffer container is transferred to the new collection container. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
