发明名称 |
PRINTED BOARD FOR MOUNTING LED, AND ITS MANUFACTURING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed board for mounting LEDs with which illumination light source can be manufactured wherein thermal deterioration is unlikely to occur, even if light emission is enhanced and that is superior in heat dissipation. <P>SOLUTION: The printed board 1 for mounting LEDs is used to mount an LED 2. A wiring pattern 3 to be connected electrically with the LED 2 is provided on one side of an insulating layer 5. A metal layer 6 for heat dissipation to release a heat producing from the LED 2 is provided on the other side thereof. Then a recessed part 7 for mounting LEDs is formed so that it penetrates the insulating layer 5 from the side of the wiring pattern 3 and reach the inside of the metal layer 6 for heat dissipation. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005243744(A) |
申请公布日期 |
2005.09.08 |
申请号 |
JP20040048621 |
申请日期 |
2004.02.24 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
TAKAHASHI HIROAKI;KATO HIROAKI |
分类号 |
H01L33/54;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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