| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrode bump, its manufacturing method and a connecting method which allows many electrodes to be connected surely for electrical connection between semiconductor chips after laminating them, and ensures a high operation reliability of semiconductor elements, such as transistors located on and around connection points. <P>SOLUTION: The top end 1b of the electrode bump 1 is formed more yieldingly to stresses than its base 1a. Hence, the electrode bump 1, disposed on the electrode pad 2 of a semiconductor chip 10-12, is pressed against another semiconductor chip to buckle and deform the top end 1b, and the pressing stress is absorbed by buckling and deforming the top end 1b to resulting in no stress being applied directly to each semiconductor chip 10-12. This reliably and easily executes the electric connection and prevents the stress in the connecting operation to the semiconductor chips 10-12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
