| 摘要 |
PROBLEM TO BE SOLVED: To increase the speed, a marking process on defective chips, and enhance simplicity and reduce cost thereof. SOLUTION: Starting from a semiconductor chip A of a semiconductor wafer 1, a marker moves to a start-point chip 3a of a first defective block 3 that is located at the shortest distance from the semiconductor chip A, and moves up to an end-point chip 3b to print defective marks 4 on all defective chips within the first defective block 3. Successively, the marker moves to a second defective block 5 that is located at the shortest distance from the end-point chip 3b of the first defective block 3, to similarly print the defective mark. Then, as for the procedure described above, the marker moves from the second defective block 5 to a third defective block 6, and similarly moves sequentially to a fourth defective block 7, a five defective block 8, a sixth defective block 9, and a final seventh defective block 10 of the semiconductor wafer 1, to print the defective marks on defective chips in each defective block. COPYRIGHT: (C)2005,JPO&NCIPI
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