Thin, plate shaped article e.g. silicon wafer, breaking device, has support mat with oval, semicircle or wedge shaped clearance recess below scratching line of article, where recess extends in moving direction of breaking stamp

摘要

The device has a support mat (13) on a top side of a base plate, and a breaking stamp that is movable in the direction of the mat. A plate shaped article that is to be broken is placed on a top side of the mat. The mat has a clearance recess (16) below a scratching line of the article and extends in a moving direction of the stamp. The recess does not extend up to the top side of the mat and is oval, semicircle or wedge shaped.