| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive resin sheet for bonding semiconductor chips, which can stabilize height of the semiconductor chips without dispersion, and can horizontally hold and laminate them, and to provide a semiconductor device obtained by using the sheet. SOLUTION: The adhesive resin sheet for bonding semiconductor chips includes resin minute particles whose mean particle diameter is 10 to 500μm. Standard deviation of particle diameter distribution in the adhesive resin sheet for bonding semiconductor chips is within 10% of the mean particle diameter of the resin minute particles. COPYRIGHT: (C)2005,JPO&NCIPI
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