发明名称 CUTTING APPARATUS AND METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To solve problems that occurrence of flash, short life of a rotary blade, lowering of efficiency, and increase in the environmental load are caused in the case of cutting members composed of different kinds of materials. <P>SOLUTION: The cutting apparatus for cutting a formed body 13 is provided with a laser beam generation means 5 for generating the laser beam fundamental wave 3 having a wavelength suitable for cutting each of the different kinds of materials of the formed body 13 and the laser beam second harmonic wave 4, an irradiation means 12 for irradiating the formed body 13 with a laser beam 9, an adsorptive base 18 on which the formed body 13 is fixed, and a transfer means which relatively moves the formed body 13 and the irradiation means 12. The formed body 13 is provided with a substrate 14, chips 16 each mounted in a plurality of regions 15 of the substrate 14, and a sealing resin 17 for sealing the chips 16 all together with the resin, and the formed body is fixed so as to make the substrate 14 face the irradiation means 12. After the substrate 14 is cut by irradiating it with the laser beam second harmonic wave 4, the sealing resin 17 is irradiated with the laser beam fundamental wave 3. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005238246(A) 申请公布日期 2005.09.08
申请号 JP20040047760 申请日期 2004.02.24
申请人 TOWA CORP;UNO YOSHIYUKI;OKAMOTO YASUHIRO 发明人 OSADA MICHIO;KITADA RYOJI;UNO YOSHIYUKI;OKAMOTO YASUHIRO
分类号 B23K26/00;B23K26/06;B23K26/40;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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