| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing accelerator for a curable resin excellent in curability in a moistened state, flowability, reflow crack resistance and shelf property at a high temperature, a curable resin composition obtained using the curing accelerator, and an electronic part device provided with an element sealed with the resin composition. SOLUTION: The curable resin composition comprises a curable resin, a curing accelerator represented by general formula (I) [wherein R<SP>1</SP>-R<SP>3</SP>are the same or different, are each a hydrogen atom or a 1-18C substituted or unsubstituted hydrocarbon group and may be linked together to form a ring structure; R<SP>4</SP>-R<SP>7</SP>are the same or different and are each a hydrogen atom or a 1-18C substituted or unsubstituted monovalent organic group; Y<SP>-</SP>is a group obtained by releasing one proton from a 0-18C monovalent group bearing at least one releasable proton; and at least two among R<SP>4</SP>-R<SP>7</SP>and Y may be linked together to form a ring structure] and an ion exchanger. COPYRIGHT: (C)2005,JPO&NCIPI
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