发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes: a gate electrode formed on a substrate; impurity regions formed in the substrate and to both sides of the gate electrode; a first interlayer insulating film formed to cover the gate electrode; and a second interlayer insulating film formed so as to be aligned in a direction parallel to the principal surface of the substrate and adjacent to the gate electrode with a part of the first interlayer insulating film interposed therebetween. The second interlayer insulating film has a lower relative permeability than the first interlayer insulating film.
申请公布号 US2005194637(A1) 申请公布日期 2005.09.08
申请号 US20050068807 申请日期 2005.03.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TAMARU MASAKI
分类号 H01L21/768;H01L21/3205;H01L21/8238;H01L23/52;H01L23/522;H01L27/092;H01L27/108;H01L29/78;(IPC1-7):H01L27/108 主分类号 H01L21/768
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