发明名称 THIN-FILM INTEGRATED CIRCUIT AND THIN-SHAPED SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a means that can read information of an integrated circuit even if the integrated circuit is in a destructed state or the like, premising an integrated circuit furnished with new identification information, to solve such a problem in a method of forming information points separately from the IC chip by forming patterns of an identifiable material that the designability of the commodity having the IC chip is degraded by the unevenness or coloring of the information points. <P>SOLUTION: An IDF having a semiconductor film with a thickness of 0.2 &mu;m or smaller, representatively 40 nm to 170 nm, and preferably 50 nm to 150 nm, as active regions, is formed, and its identification information is formed within the IDF chip. Furthermore, a visual display means is provided in a thin-shaped semiconductor device having the thin-film integrated circuit. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005244132(A) 申请公布日期 2005.09.08
申请号 JP20040055466 申请日期 2004.02.27
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 ARAI YASUYUKI;AKIBA MAI;JINNO YOHEI;TATEMURA YUKO
分类号 G06K19/08;G06K19/07;G06K19/10;H01L21/336;H01L21/822;H01L23/00;H01L27/04;H01L29/786 主分类号 G06K19/08
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