| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus with high productivity which controls detachment and a destructive phenomenon occurring at a junction between a translucent board and a solid imaging device, namely, a junction between a mold resin and an electrode pad of a thin-film wiring layer, and a junction between the electrode pad of the thin-film wiring layer and a wax member of the solid imaging device, whose connection reliability is mechanically and electrically high, and which can obtain an excellent image. SOLUTION: An imaging apparatus is provided with a translucent board 1, a resin film layer 3 bonded to one main surface of the translucent board 1 through an adhesive layer 2, a thin-film wiring layer 4 with an electrode pad 4e laminated on the resin film layer 3, and a solid imaging device 8 electrically connected to the electrode pad 4e. In the electrode pad 4e, a plurality of openings 4f which expose the resin film layer 3 to a circumference of a circle within the electrode pad 4e whose center is a center of the circumference are formed. COPYRIGHT: (C)2005,JPO&NCIPI
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