| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cover body for electronic component, accommodating package and an electronic apparatus using the same which can hold airtightness of the electronic apparatus, even if thermal hystersis of 250 to 260°C is applied, when the electronic apparatus is mounted to an external electric circuit or the like, and will not pollute earth's environment, because it does not contain lead. <P>SOLUTION: The cover body 4 is provided with a metal layer 2, consisting of a nickel-cobalt alloy which is formed to the entire circumferential part of the external circumference of the lower surface of a plate body 1, and a solder layer 3 consisting mainly of tin formed to the entire circumferential part of the surface of the metal layer 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
