发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board which can electrically connect connection pads stably to an external electric circuit over a long period of time, where its insulating substrate is a rectangle and the plurality of connection pads are formed along both the longer sides of the main surface. SOLUTION: The wiring substrate 9 includes the rectangular insulating substrate 1, composed of ceramics in which a wiring conductor 2 is formed, the plurality of connection pads 3 which are electrically connected with the wiring conductor 2 and are formed along both the longer sides of the main surface of the insulating substrate 1; and a metallized layer 4 which is formed in the center portion of the main surface of the insulating substrate 1 parallel to the longer side direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005244156(A) 申请公布日期 2005.09.08
申请号 JP20040221195 申请日期 2004.07.29
申请人 KYOCERA CORP 发明人 FUKUTOME YUJI;IMUTA KAZUHITO
分类号 H01L23/12;H01L23/13;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址